Cleaning Systems — Ultra C vac Cleaning Tool

The Ultra C vac cleaning tool for fan-out wafer-level packaging (FOWLP) is designed to meet the unique flux removal requirements for chiplets and other advanced 3D packaging structures. It addresses the unique requirement of removing flux that is used after reflow as part of the advanced packaging process.

As feature sizes of these devices continue to shrink, traditional cleaning under atmospheric pressure is no longer sufficient. By developing the Ultra C vac flux cleaning tool that can clean under vacuum, surface wetting ability is improved for liquid to flow into very narrow spaces to fully remove flux residues within a reasonable cleaning time. For devices that require very high flux dipping, a saponification agent can be added to achieve a complete clean.

Major Benefits

• Utilizes vacuum technology to efficiently remove flux residues from structures with bump pitches and standoff height <20 µm.
• Vacuum technology ensures good chemical penetration and complete cleaning of all structures.

Equipment Specifications

• 4 vacuum cleaning chambers, 1 post-clean and drying chamber and 3 hot plates
• Configuration of 2 load ports
• Able to use SAPS, hot DIW with high-pressure DIW under vacuum
• MTBF: 500 hours
• Uptime: 95%
• Wafer breakage: <1/100,000
• Warpage: ≤3 mm
• WPH: ≥4
• SAPS auto-recycle system, recycle ratio is ~95%
• Vacuum can be controlled by recipe from 25-400 Torr
• No flux residual