Wet Processing

Discover ACM’s Wet Processing Capabilities

In IC manufacturing, wafer-level packaging, and compound semiconductor device manufacturing, wet wafer processes are ideal for both removal and additive processes like wafer cleans, etch, photoresist strip, metal lift-off, coating, and developing.

How Many Wet Wafer Processes Do You Support?

In all, you may perform up to 500 cleaning and surface preparation steps, numerous photoresist stripping variations to remove patterning film layers, and etch processes to create patterns and vias. All these processes are critical for preventing wafer contamination and improving yields.

When you’re building advanced microelectronics to meet today’s power, performance, and cost requirements, you need high-performance wet processes that deliver contaminant-free, high-yielding, reliable devices. Our proprietary processes and leading-edge tools will take you there.