PECVD Systems—Ultra Pmax™

Plasma-enhanced chemical vapor deposition (PECVD) tool

Your legacy node (28nm and above) logic devices require the best in thin and thick film deposition. Our Ultra Pmax™ PECVD tool is equipped with a proprietary designed chamber, gas distribution unit, and chuck to deliver better film uniformity, reduced film stress, and improved particle performance. Ultra Pmax™ PECVD tool lets you increase your capacity at more mature nodes.

Ultra Pmax™ PECVD tool Features and Benefits

The Ultra Pmax is available in two configurations: a one- to three-chamber design that is ideal for very thin layers or fast process steps and a four- to five-chamber design that supports thick film deposition and longer process times while still optimizing throughput. Both configurations have multiple heaters per chamber for greater process control and higher productivity.

• Ultra Pmax™ PECVD tool offers multi-frequency RF generators:
  • High frequency runs at 13.56 MHz to 27.12 MHz
  • Low frequency runs at 350KHz~450KHz
• Each chamber has three heaters
• Offers process-specific chamber designs
• A liquid delivery system with a proprietary vaporizer eliminates the need for carrier gas
• An additional robot arm supports three wafers
• The proprietary control software features a separate RF system for each component