Track Systems – Ultra Lith BK

As lithography advances, greater system precision and reliability are required. Improvements in uniformity and process control are essential to maintain yield and device performance. The Ultra Lith Baker (Ultra Lith BK) combines high uniformity with a configurable system architecture and multiple exposure modes to help minimize variability and support scaling to future technology nodes.

The Ultra Lith BK is engineered to address industry-wide challenges in advanced lithography for both semiconductor wafer and display panel manufacturing. The system is designed to reduce process non-uniformity, thermal drift and critical dimension (CD) variation while helping to maintain stable yield and pattern fidelity as device geometries continue to shrink. With industry-leading ultraviolet (UV) curing uniformity and precision temperature control, the Ultra Lith BK enables highly stable and repeatable lithography processes.

Major Benefits

• Combines high uniformity with a configurable system architecture and multiple exposure modes to minimize variability and support scaling 
• Configurable design with support for up to 32 hot plates and two UV curing systems to meet diverse process requirements
• UV curing system delivers ±5% intensity uniformity, ensuring consistent resist hardening across the wafer
• Supports line-scan, rotary and hybrid UV-curing exposure modes for maximum process flexibility
• Integrates six cold plates delivering temperature uniformity of ±0.1°C
• Advanced thermal management reduces CD variation, overlay error and pattern distortion

Features and Specifications

• Supports up to 32 hot plates and 6 cold plates
• Two hot plate configurations:
  • High-flow hot plate up to 250°C with temperature uniformity ≤0.20%
  • Low-flow hot plate up to 180°C with temperature uniformity ≤0.08%
• UV curing system with ±5% light intensity uniformity
• Supports line-scan, rotary and combined line-scan + rotary exposure modes