Track Systems – Ultra Lith KrF

ACM’s Ultra Lith_KrF track system is designed to support front-end semiconductor manufacturing, delivering high-throughput performance, advanced thermal control, and real-time process control and monitoring. Built on the proven architecture and process achievements of our ArF track platform, the KrF system enables sub-angstrom-level coating uniformity and advanced thermal control.

KrF lithography remains essential for mature-node devices such as GaN and SiC power chips, which represent a significant and growing share of global semiconductor manufacturing. By offering both ArF and KrF track systems, we provide seamless fab integration and greater manufacturing flexibility across diverse applications.

Major Benefits

• High throughput (>300 wafers per hour), enabling more efficient utilization of lithography scanners
• BARC coating uniformity (3σ) <5Å at 800Å thickness target
• PR coating uniformity (3σ) <8Å at 1,800Å thickness target
• Equipped with a high-precision thermal hot plate, delivering temperature uniformity (3σ) <0.1% at a target temperature of 110°C

Features and Specifications

• 54 advanced hot plates supporting low-, mid- and high-temperature processes with ultra-precise temperature control, rapid cooling and vacuum wafer chucking
• 12 spin coating chambers (12C) and 12 develop chambers (12D)
• Proprietary backside particle removal unit (BPRU) technology to minimize cross-contamination from wafer backside particles 
• Wafer-scale outlier inspection (WSOI) unit for real-time process variation control and yield anomaly detection