Scrubber Systems—Ultra C s

ACM Research’s Ultra C s scrubber tool expands the company’s scrubber capabilities, proven for wafer-level packaging (WLP), to IC foundry processing. With its advanced dual-fluid spray-cleaning technique using gentle nitrogen gas (N₂) spray, backside brush and bevel brush, using a precise pressure control system, the tool provides high-efficiency particle removal and scratch-free cleaning of the wafer frontside, backside and bevel. It can also be optionally equipped with ACM’s patented SAPS™ megasonic technology for more intense cleaning and removal of smaller particles.

The system’s modular design allows the Ultra C s to be configured with eight chambers for 300mm IC applications—four each for frontside and backside cleaning. With its flexibility, small footprint and high throughput, the Ultra C s offers a cost-effective scrubber solution.

Features & Specifications

• Flexible cleaning method combination
  • Dual-fluid spray-cleaning
  • Backside brush clean
  • Bevel brush clean
  • Optionally equipped with SAPS™ advanced cleaning
• Double-sided sequential cleaning capability with wafer-flipping function
• Flexible configuration
  • For IC manufacturing – eight chambers, 300mm wafer compatibility
  • For WLP – four chambers, 200m and 300mm wafer compatibility