ACM Research was honored to receive a 2025 Global Technology Award in the category of Cleaning Equipment for its Ultra C vac-p flux cleaning tool. Presented annually by Global SMT & Packaging, the awards recognize top-performing and trailblazing solutions addressing the electronics manufacturing industry’s most critical challenges.
The award was presented during a ceremony at productronica in Munich, Germany, on November 18, 2025. Members of ACM’s leadership team were in attendance to accept and celebrate this international recognition, highlighting the company’s continued progress in delivering advanced cleaning technologies for next-generation packaging.
“We are honored that the Ultra C vac-p has been recognized with the 2025 Global Technology Award in Cleaning Equipment,” said Dr. David Wang, CEO and president. “This award reflects our team’s dedication to delivering advanced cleaning solutions that address the most critical challenges in panel-level packaging. With vacuum technology and proprietary IPA drying, the Ultra C vac-p ensures precision and reliability, helping manufacturers achieve higher yields and improved device performance.”
Ultra C vac-p: Advanced Flux Cleaning for Panel-Level Packaging
Introduced in July 2024, the Ultra C vac-p addresses one of the most challenging steps in advanced packaging: flux residue removal before underfilling. Engineered on ACM’s proven wafer-cleaning platforms for fan-out-wafer-level packaging (FOWLP) and high-bandwidth memory (HBM), the Ultra C vac-p allows manufacturers transitioning to fan-out panel-level packaging (FOPLP) reduce costs and improve yield performance.
Traditional cleaning methods often struggle with small bump pitches (less than 40 µm) and large chip sizes due to surface tension and limited liquid penetration. The Ultra C vac-p’s vacuum technology ensures the cleaning liquid thoroughly reaches all gaps, even across large panel substrates. Combined with ACM’s proprietary IPA drying technology, the system provides a comprehensive cleaning process that removes residues and prevents voids that could impair device performance.
As the industry rapidly advances toward more complex 2.5D and 3D architectures, the Ultra C vac-p has achieved consistent cleaning across complex panel designs and chiplets. Its performance reinforces ACM’s reputation for providing high-precision, reliable cleaning solutions for next-generation packaging.
Driving the Future of Advanced Packaging Cleaning
The recognition of the Ultra C vac-p reflects ACM Research’s ongoing commitment to improving cleaning technologies for advanced packaging that support higher yields, lower operating costs, and scalable growth for global semiconductor manufacturers.
As ACM continues to expand its advanced packaging portfolio, the company remains focused on developing solutions that meet evolving process and performance requirements, enabling the next generation of device architectures with reliable, high-precision cleaning.