ACM Research was named the 2025 Innovator of the Year by the Portland Business Journal, receiving the top honor in the publication’s annual Oregon Makers & Manufacturing Awards. Each year, the Portland Business Journal recognizes manufacturers driving the regional economy through innovation, excellence, and productivity. The Innovator of the Year award specifically highlights one company whose breakthrough advancements are transforming its industry.
ACM Research has experienced strong growth, including significant revenue increases, geographic expansion, employee growth, and continued innovation in manufacturing processes.
“This recognition is a testament to the creativity, hard work, and commitment of our team,” said Dr. David Wang, CEO and president. “We’re proud to lead innovation in semiconductor manufacturing and contribute to Oregon’s thriving technology ecosystem.”
We’re honored to be recognized alongside 14 other outstanding manufacturers that were celebrated in additional award categories. Together, these companies represent the strength and ingenuity driving Oregon’s manufacturing sector and the region’s long-term economic growth.
Attending the award ceremony in October 2025 were CEO and President Dr. David Wang, VP of Sales Jim Straus, and General Manager Henan Zhang, who graciously accepted the award on the company’s behalf.
Driving Growth Through Semiconductor Manufacturing Innovation
Over the past year and a half, our company has experienced significant financial growth, enabling new endeavors and enhancements, including the introduction of cutting-edge, top-of-the-line processes to the industry. With $557 million in revenue reported in 2023, we saw a 40.2% increase to $782.1 million in 2024. Adding to our successes and achievements, we expanded our market share, capitalizing on product cycles and deepening engagements with key customers, punctuated by a 63% increase in total shipments year over year.
As the semiconductor industry advances toward greater cost efficiency and performance through the adoption of panel-level packaging, our team is driving innovation with a forward-looking approach. By leveraging our deep expertise in wafer-level packaging, we introduced three breakthrough tools, each designed to address critical process needs:
- The Ultra C vac-p tool offers superior flux cleaning for advanced fan-out wafer-level packaging (FOWLP) and high-bandwidth memory (HBM) processes. The Ultra C vac-p addresses critical steps in the advanced packaging process, particularly the removal of flux residue before underfilling, which is essential for eliminating voids, offering strong benefits for fan-out panel-level packaging (FOPLP), chiplets, and 2.5D/3D structures.
- The Ultra ECP ap-p tool addresses panel-level copper deposition for FOWLP. The Ultra ECP ap-p supports advanced FOPLP with submicron features on large panels, which are applicable to artificial intelligence (AI) applications using large chiplet graphic processing units (GPUs) and high-density HBM.
- The Ultra C bev-p tool provides bevel etching and cleaning for chiplets. The first-of-its-kind tool is specifically designed for bevel etching and cleaning in copper-related processes and can handle both the front and back sides of panel bevel etching within a single system. This double-sided capability enhances process efficiency, yields and product reliability in copper-related applications.
Together, these technologies tackle key panel-level processing challenges, reduce production bottlenecks, improve yields, and enable advanced packaging structures essential for AI and high-performance computing applications.
Expanding into Oregon’s Silicon Forest
In November 2023, we expanded into Oregon with the opening of our Hillsboro facility, establishing a presence in the heart of the rightly named “Silicon Forest.” Surrounded by industry leaders such as Intel, Nvidia, ASML, and Synopsys, this move marked a significant milestone in strengthening our U.S. footprint.
The expansion also doubled our U.S. workforce, underscoring our commitment not only to the region’s growing semiconductor ecosystem but also to the people and communities that sustain it. The Hillsboro location has further expanded our R&D and demonstration capabilities, supporting continued innovation and customer collaboration.
Strengthening Oregon’s Manufacturing Ecosystem
As we continue to grow, we look forward to collaborating with more local partners and contributing to the expansion of Oregon’s manufacturing ecosystem. Our Hillsboro facility represents more than geographic expansion; it’s a long-term investment in the region and the people who make it thrive.
We’re proud to have strong roots in Oregon as we enter this next chapter of innovation and development, and we look forward to continuing to advance the region’s reputation as a hub for world-class semiconductor manufacturing and technology leadership.