Following the launch of our ACM Planetary Family™, which brings together a process-aligned portfolio for semiconductor manufacturing, we delve deeper here into each of the planet series and how they reflect our product lines. Our offerings are grouped into eight different series that represent the essential stages in front-end and advanced packaging, providing a clearer path to identifying the right solutions for specific needs.
With this approach, customers can more easily find the solutions that align with their processes, even as device architectures, materials and manufacturing requirements continue to evolve.
Introducing the Semiconductor Planetary Product Portfolio: Eight Planets Series
Earth Series: Cleaning Tools
The Earth series features our vast portfolio of advanced wet processing and cleaning tools designed to address 95% of all cleaning processes required in chip manufacturing. The semiconductor manufacturing process is complex, requiring several hundred cleaning steps. We have remained steadfast in our commitment to independent innovation in cleaning technology.
Our Earth Series features our proprietary technologies: Space Alternated Phase Shift (SAPS™), Timely Energized Bubble Oscillation (TEBO™), Smart Megasonix™ and supercritical CO2 (scCO2) drying technology.
Jupiter Series: Wafer-Level Advanced Packaging Tools
The Jupiter series reflects our purposeful expansion into wafer-level advanced packaging. Since 2012, we have strategically entered the advanced packaging wet processing sector by developing wet stripping tools, wet metal etching tools, coating and developer tools, and silicon etching tools. Progressing step-by-step, we facilitated the advancement in 3D integrated packaging technologies.
Venus Series: Electroplating Tools
The Venus series embodies that planet’s characteristic stability and reliability, which are mirrored in the performance of our electrochemical plating (ECP) equipment. In 2019, we achieved mass production deployment for our copper interconnect multi-anode plating equipment, marking a huge milestone in our electroplating portfolio.
Leveraging this foundation, our multi-anode technology has achieved proficiency in plating for both circular and rectangular wafers. This advancement facilitates comprehensive coverage throughout the semiconductor plating workflow, encompassing front-end damascene processes, mid-end through-silicon-via (TSV) integration and back-end advanced packaging.
Mars Series: Furnace Tools
Much like the planet Mars—which symbolizes breakthrough and resilience— our Mars series of furnace tools brings breakthrough innovation, covering all thermal processing applications from low-pressure chemical vapor deposition (LPCVD) and medium- to high-temperature annealing to atomic-level deposition (ALD) of up to 135°C. Building on our first vertical furnace tool order in 2020, which established our presence in the dry process equipment market, this series has become a new growth engine driven by technical expertise and persistent execution.
Mercury Series: Track Tools
Our Mercury series embodies the speed and precision this planet is known for. Our track systems are engineered to integrate seamlessly with the photolithography workflow and maximize production efficiency. At ACM, we’ve put the expertise of our cleaning, coating and developing process tools into our track systems. Our 300mm process tools deliver uniform air downflow, fast robot handling and software tailored to customer requirements.
Saturn Series: Plasma-Enhanced Chemical Vapor Deposition (PECVD) Tools
The Saturn series features our plasma-enhanced chemical vapor deposition (PECVD) equipment. The core philosophy of this series reflects how Saturn’s rings symbolize the passing of time and enduring reliability. We provide a globally unique and reliable triple-stack process chamber design and proprietary “One Station, One RF” control software technology that lay the robust microscopic structural foundations for advanced semiconductor chips.
Uranus Series: Panel-Level Advanced Packaging Tools
Our panel-level packaging portfolio comes to life in the Uranus series, inspired by that planet’s association with breakthrough and innovation. In 2024, in response to growing demand for large-format AI chips, we introduced this series to support the industry’s shift toward advanced panel-level packaging.
Leveraging our expertise in advanced package cleaning and plating, we developed a suite of panel-level process tools designed to meet advanced manufacturing requirements and enable increasingly complex structures. The Uranus portfolio includes panel-level plating, flux cleaning and double-sided bevel etching equipment, all built to accelerate high-throughput, next-generation chip packaging.
Neptune Series: Stress-Free Polishing Tools
Reflecting Neptune’s connection to depth and foresight, this series consists of our stress-free polishing (SFP) equipment, engineered to achieve atomic-level polishing and boost planarization performance to new heights.
By reducing mechanical stress and enabling a more uniform surface entering planarization, ACM’s SFP technology supports more stable processes, higher yield and the precision required for next-generation HPC and AI chip manufacturing.
Long-Term Vision for the Semiconductor Planetary Product Portfolio
The introduction of the ACM Planetary Family, featuring eight product series, reflects the company’s evolution from a single cleaning product line into a diversified, integrated portfolio of comprehensive and complementary technologies. By organizing our tools within a unified framework, we are reinforcing our long-term strategy of technological differentiation, product platformization and global customer engagement.
At the center of this structure are our customers. Much like planets orbit the sun, our innovation remains anchored to our customers’ needs, guiding how we develop and refine our solutions while continuously evolving to meet new demands.
As the semiconductor industry advances toward heterogeneous integration and chiplet-based architectures, collaboration becomes increasingly critical. We work closely with customers and partners to co-develop process technologies and address complex manufacturing challenges at every stage of the ecosystem.
As we continue to expand our portfolio across front-end processing and advanced packaging, from wafer-level to panel-level applications, our focus remains on enabling the next wave of semiconductor innovation.
For more insights into ACM’s technologies and approach to semiconductor innovation, contact our team at contact@acmr.com.