November 13, 2025 ~ Challenges with Conventional Chemical Mechanical Polishing As logic device dimensions continue to shrink, new interconnect materials are required to maintain electrical performance and long-term reliability. Ruthenium (Ru) has emerged as a strong candidate for advanced logic applications, including high-performance computing (HPC) and artificial intelligence (AI). With its superior electrical characteristics and lower diffusion tendency compared […] Read More
Blogs and Articles
October 20, 2025 ~ ACM Research was named the 2025 Innovator of the Year by the Portland Business Journal, receiving the top honor in the publication’s annual Oregon Makers & Manufacturing Awards. Each year, the Portland Business Journal recognizes manufacturers driving the regional economy through innovation, excellence, and productivity. The Innovator of the Year award specifically highlights one company […] Read More
August 18, 2025 ~ Plasma-enhanced chemical vapor deposition (PECVD) has been a critical part of the semiconductor manufacturing process since the 1980s. With chipsets designed for AI applications transitioning from wire bonding to 2.5 and 3D packaging, PECVD processes have rapidly gained importance within the heterogeneous manufacturing process. PECVD enables the deposition of high-quality dielectric films for 3D packaging […] Read More
July 15, 2025 ~ Plasma-enhanced chemical vapor deposition (PECVD) is one of the fundamental building blocks for manufacturing ICs. From building the transistor to metallization, the PECVD process has applications critical for microelectronics manufacturing. PECVD allows to create a desired reactive gas plasma to deposit a thin film on the wafer. Typically, PECVD tools are used in manufacturing most […] Read More
June 30, 2025 ~ Cleaning Matters in the 3D Era While some people believe Moore’s Law is running out of steam, the chip industry continues to scale semiconductor devices into the third dimension, increasing transistor density with every new chip generation. The semiconductor transistor continues to evolve, moving from planar to FinFET to gate-all-around (GAA) structures. The memory side […] Read More
June 23, 2025 ~ International Women in Engineering Day is about recognizing and highlighting the achievements of women in engineering and encouraging more women to enter the field. Despite progress, women made up just 13.7% of the global engineering workforce in 2023, with men representing 86.3%1. Engineering offers an exciting and varied career, full of new challenges every day, […] Read More
May 27, 2025 ~ High-performance computing has been reshaping the semiconductor industry for more than a decade. The explosive growth of computing power needed for artificial intelligence (AI) has been driving hyperscale data centers, which in turn, have been driving the need for high-performance semiconductor systems. The concept of packaging logic chiplets with high bandwidth memory (HBM) into multi-reticle […] Read More
March 31, 2025 ~ This year, we’re again incredibly proud to sponsor FIRST® Robotics Team 4488 SHOCKWAVE from Glencoe High School, a local school near our Hillsboro, Oregon facility. FIRST (For Inspiration and Recognition of Science and Technology), a global nonprofit founded in 1989, is dedicated to inspiring young people’s passion for STEM (Science, Technology, Engineering, and Math) while […] Read More
March 12, 2025 ~ Multi-reticle packages – optical devices with multiple reticle patterns that are user-switchable as needed – are becoming increasingly common as hyper-scale computing and other applications such as artificial intelligence (AI) adopt 2.5D to 3.5D device packaging. The advanced packaging industry, in turn, is implementing larger, panel-level packaging (PLP) to improve yield and increase throughput for […] Read More
January 13, 2025 ~ The 3D packaging sector has been growing rapidly, driven by the expansion of chiplet packaging across the ecosystem. Chip and package sizes have also grown rapidly as 2 x 800mm2 chips are being placed in a single package along with high-bandwidth memory (HBM). Demand for these large chiplets has generated supply constraints due to how […] Read More