Blogs and Articles

Leading the Way in Electroplating

March 23, 2023 ~ What Is Electroplating or ECP? Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal using a direct electric current. The part to be coated acts as the cathode (negative electrode) of an electrolytic cell; the electrolyte […] Read More

ACM Research's TEBO megasonic cleaning technology, which uses high-frequency oscillation of very small bubbles to clean advanced devices without damaging fragile structures.

Making Smart Megasonix™ Even Smarter

March 9, 2023 ~ Traditional megasonic cleaning combines high-frequency sound waves, typically in the range of 360 kHz to 2,000 kHz, with a liquid flow process to remove submicron particles from wafer surfaces. The fluid motion created by the high-frequency megasonics is intended to result in low substrate damage. However, conventional megasonic cleaning has reached practical limits because it […] Read More

Wet Bevel Etch and Cleaning Improves Wafer Yields and Throughput

November 2, 2022 ~ Throughout this blog series, we’re examining vital wafer cleaning processes and how we are addressing them through our solutions. In this post, we’ll look at bevel etch: what it is, associated challenges, and how our approach offers notable advantages for tackling those challenges compared to traditional dry bevel etch. The bevel etch process is used […] Read More

Post-CMP Cleaning Options for SiC and Silicon Substrates

August 31, 2022 ~ Our last blog post addressed in-depth the rise of silicon carbide (SiC)-based chips and how we address the cleaning challenges surrounding them. With their innate thinness, brittleness, and tendency toward surface inconsistencies, SiC wafers require particular care with respect to their processing and handling, and we have a broad portfolio of tools that make sure […] Read More

Overcoming Silicon Carbide (SiC) Manufacturing Challenges

May 27, 2022 ~ Why Silicon Carbide (SiC) Is Critical for Next-Generation Chips Silicon carbide (SiC) substrate-based chips are on the (very) fast track due to the need for power semiconductors that can handle high voltage under challenging conditions. The automotive industry wants SiC chips so it can increase range and decrease charging time for electric vehicles (EVs). The […] Read More

Will Compound Semiconductors Power the Future?

June 29, 2021 ~ By Sally-Ann Henry and Jim Straus, ACM Research Let’s face it: When it comes to choosing a substrate material for building power semiconductors, silicon (Si) is no match for up-and-coming compound semiconductors like silicon carbide (SiC) and gallium nitride (GaN). Because of their fundamental material properties, these compound semiconductors can do things that simply aren’t […] Read More

semiconductor supply chain

Is the Semiconductor Supply Chain Ready for Long-Term Growth?

April 19, 2021 ~ In early 2020, the semiconductor supply chain was gearing up for a growth year after pushing through 2019’s 12% year-over-year decline in chip sales. According to the Semiconductor Industry Association, this was due to global trade unrest and cyclical pricing.1 Then COVID-19 hit, forcing temporary shutdowns while we figured out the safest next move. The […] Read More

sustainability in semiconductors

What You Need to Know About Sustainability in Semiconductors

March 11, 2021 ~ By Jim Straus While the global spotlight is shining on the importance of sustainability in semiconductors, the concept itself is not new. As early as 2003, when the European Union adopted the Restriction of Hazardous Substances Directive, semiconductor manufacturing companies started to become more aware of their impact on the environment and launched efforts that […] Read More